Classification of IGBT Models

FS950R08A6P2LB

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS950R08A6P2LB comes with a PinFin baseplate and performance ceramic.

Package / Case :

FS950R08A6P2B

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS950R08A6P2B comes with a PinFin baseplate and performance ceramic.

Package / Case :

FS900R08A2P2_B31

Brands : Infineon

Description : HybridPACK™ 2 750 V, 900 A 3-phase six-pack of Micro-Pattern EDT2 TRENCHSTOPTM with matching emitter controlled diode is an automotive qualified power module with direct cooled PinFin Base Plate designed for Hybrid- and Electric Vehicle applications from a power range up to 150 kW continuous power. Pin connection is enabled via Sn coated pins.

Package / Case :

FS820R08A6P2LB

Brands : Infineon

Description : HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product derivate FS820R08A6P2LB has long AC power terminals and is well suited for implementation of phase current sensor solutions.Find appropriate Automotive EiceDRIVER™.

Package / Case :

FS820R08A6P2

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics.

Package / Case :

FS770R08A6P2LB

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS770R08A6P2LB comes with a baseplate with bonded cooling structure.

Package / Case :

FS770R08A6P2B

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS770R08A6P2B comes with a baseplate with bonded cooling structure.

Package / Case :

FS75R12W2T7_B11

Brands : Infineon

Description : EasyPACK™ 2B 1200 V, 75 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode, NTC and PressFIT contact technology.

Package / Case :

FS75R12W2T7

Brands : Infineon

Description : EasyPACK™ 2B 1200 V, 75 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode and NTC.

Package / Case :

FS75R12N2T7_B15

Brands : Infineon

Description : EconoPACK™ 2 1200 V, 75 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode and NTC (alternative mechnically compatible to an IGBT3 module).

Package / Case :

FS75R12KT4

Brands : Infineon

Description : EconoPACK™ 2 1200 V, 75 A sixpack IGBT module with fast TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC and solder pin contact technology. Also available with PressFit contact technology.

Package / Case :

FS660R08A6P2FLB

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS770R08A6P2LB comes with a flat baseplate.

Package / Case :

FS660R08A6P2FB

Brands : Infineon

Description : The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS660R08A6P2FB comes with a flat baseplate.

Package / Case :

FS650R08A4P2

Brands : Infineon

Description : The HybridPACK™ DC6i is a very compact six-pack module (750V/650A) optimized for hybrid and electrical vehiclesThis power module complements the benchmark EDT2 IGBT generation with Direct Cooled Base Plate with Ribbon Bonds, NTC temperature sensor and PressFIT contact technology for up to 500V DC and 400 Arms capability enabling inverter designs around 100kW power range*.

Package / Case :

FS50R12W2T7_B11

Brands : Infineon

Description : EasyPACK™ 2B 1200 V, 50 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode, NTC and PressFIT contact technology.

Package / Case :

FS50R12W2T7

Brands : Infineon

Description : EasyPACK™ 2B 1200 V, 50 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode and NTC.

Package / Case :

FS50R12W1T7_B11

Brands : Infineon

Description : EasyPACK™ 1B 1200 V, 50 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode, NTC and PressFIT contact technology.

Package / Case :

FS50R12W1T7

Brands : Infineon

Description : EasyPACK™ 1B 1200 V, 50 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode and NTC. Also available with PressFIT contact technology.

Package / Case :

FS50R12N2T7_B15

Brands : Infineon

Description : EconoPACK™ 2 1200 V, 50 A sixpack IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode and NTC (alternative mechnically compatible to an IGBT3 module).

Package / Case :

FS50R12KT4P_B11

Brands : Infineon

Description : EconoPACK™ 2 1200 V, 50 A sixpack IGBT module with fast TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material.Please also find our EiceDRIVER™ HV Gate Driver Family. Including our EiceDRIVER™ Enhanced Driver ICs for your easy and reliable design.

Package / Case : Module

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